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| Title | Wafer Bonding : Applications and Technology |
| Author(s) | Alexe, Marin;G??sele, Ulrich |
| Publication | Berlin, Heidelberg, Springer Berlin Heidelberg, 2004. |
| Description | XV, 504 p. 383 illus., 20 illus. in color : online resource |
| Abstract Note | During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information |
| ISBN,Price | 9783662108277 |
| Keyword(s) | 1. Characterization and Evaluation of Materials
2. CONDENSED MATTER
3. CONDENSED MATTER PHYSICS
4. EBOOK
5. EBOOK - SPRINGER
6. ELECTRICAL ENGINEERING
7. Electronic materials
8. MATERIALS SCIENCE
9. Materials???Surfaces
10. Optical and Electronic Materials
11. OPTICAL MATERIALS
12. Surfaces and Interfaces, Thin Films
13. THIN FILMS
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| Item Type | eBook |
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Circulation Data
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Call# | Status | Issued To | Return Due On | Physical Location |
| I11419 |
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