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Author | Title | Accn# | Year | Item Type | Claims |
| 1 |
Lieng-Huang Lee |
Adhesives, Sealants, and Coatings for Space and Harsh Environments |
I04941 |
1988 |
eBook |
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| 2 |
Lieng-Huang Lee |
Adhesive Chemistry |
I01208 |
1984 |
eBook |
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| Title | Adhesives, Sealants, and Coatings for Space and Harsh Environments |
| Author(s) | Lieng-Huang Lee |
| Publication | New York, NY, Springer US, 1988. |
| Description | X, 540 p. 66 illus : online resource |
| Abstract Note | New technologies constantly generate new demands for exotic materials to be used in severe environments. The rapid developments of aerospace industries during the last two decades have required new materials to survive extreme high and low temperatures and various radiations. The exploration of new energy sources, e.g., solar and geothermal, has led us to develop new solar collectors and geothermal devices. Even the search for new oils has demanded that we study the corrosive environment of oil fields. In the telecommunication industries, optical fibers have been adopted broadly to replace metallic conductors. However, none of the optical fibers can survive abrasion or corrosion without the application of a coating material. For microelectronics, protection in terms of coatings and encapsulants is deemed necessary to prevent corrosion. One of the major causes of corrosion has been shown to be water which appears to be abundant in our earthly environments. Water can attack the bulk adhesive (or sealant), the interface, or the adherend. Water can also cause delamination of coating film, and it is definitely the major ingredient in causing cathodic or anodic corrosion. Thus, water becomes the major obstacle in solving durability problems of various materials in harsh environments |
| ISBN,Price | 9781461310471 |
| Keyword(s) | 1. CHEMICAL ENGINEERING
2. EBOOK
3. EBOOK - SPRINGER
4. Industrial Chemistry/Chemical Engineering
5. ORGANIC CHEMISTRY
6. Polymer Sciences
7. Polymers????
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| Item Type | eBook |
Multi-Media Links
Please Click here for eBook
Circulation Data
| Accession# | |
Call# | Status | Issued To | Return Due On | Physical Location |
| I04941 |
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On Shelf |
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2.
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| Title | Adhesive Chemistry : Developments and Trends |
| Author(s) | Lieng-Huang Lee |
| Publication | New York, NY, Springer US, 1984. |
| Description | 871 p : online resource |
| Abstract Note | Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D. C. , this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in surface science and fracture mechanics. Moreover, new adhesives have been invented and applied in actual structures, for example, structural and aerospace adhesives. In response to socio-economic demands, new forms of adhesives have been introduced to combat the problems of pollution and to promote energy-conservation. The developments of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vivid examples of successes in solving some of the problems. As chemists, our hatural desire is to understand how those new adhesives and new forms of adhesives are made. Thus, we are interested in learning about the chemistry of adhesives so that we may create new generations of materials to satisfy future needs. It was based on this common interest that w~ set forth to org'anize this Symposium on Recent Developments in Adhesive Chemistry. It was held from March 21 through 23, 1983 in the Westin Hotel, Seattle, Washington. The Symposium was very well attended. As a matter of fact, for the first two sessions, we had to move from the smaller Mt. St |
| ISBN,Price | 9781461324355 |
| Keyword(s) | 1. CHEMICAL ENGINEERING
2. EBOOK
3. EBOOK - SPRINGER
4. Industrial Chemistry/Chemical Engineering
5. ORGANIC CHEMISTRY
6. Polymer Sciences
7. Polymers????
|
| Item Type | eBook |
Multi-Media Links
Please Click here for eBook
Circulation Data
| Accession# | |
Call# | Status | Issued To | Return Due On | Physical Location |
| I01208 |
|
|
On Shelf |
|
|
|
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