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Author | Title | Accn# | Year | Item Type | Claims |
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Mohd Salleh, Mohd Arif Anuar |
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium |
I12875 |
2023 |
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| Title | Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia |
| Author(s) | Mohd Salleh, Mohd Arif Anuar;Che Halin, Dewi Suriyani;Abdul Razak, Kamrosni;Ramli, Mohd Izrul Izwan |
| Publication | Singapore, 1. Imprint: Springer
2. Springer Nature Singapore, 2023. |
| Description | XLI, 875 p. 475 illus., 386 illus. in color : online resource |
| Abstract Note | This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials |
| ISBN,Price | 9789811992674 |
| Keyword(s) | 1. EBOOK - SPRINGER
2. ELECTRONIC DEVICES
3. ELECTRONICS
4. Electronics and Microelectronics, Instrumentation
5. Green chemistry
6. SOLID STATE PHYSICS
7. Surface and Interface and Thin Film
8. Surfaces (Physics)
9. Sustainability
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| Item Type | eBook |
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| I12875 |
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